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Products

ZL-XJ-002
Source:ZhongLi Tools  Time:2023-10-31 04:51:43  Views:206

Product Features

Applied in the photovoltaic industry (single crystal, polycrystalline silicon slice), cutting of hard and brittle materials such as sapphire, magnetic materials, ceramics, etc.
Main Technical Parameters

Purpose

Model

Perimeter/mm

Wire diameter/mm

Breaking force/N

Monocrystalline silicon truncation

HXS0652960

2960

0.65

≥210

HXS0502960

2960

0.50

≥160

HXS0422960

2960

0.42

≥150

Single crystal silicon square root

HXS0504100

4100

0.50

≥160

HXS0424100

4100

0.42

≥150

Tips:Other specifications can be customized according to customer needs.
Product Introduction
1) Unidirectional high-speed motion, high cutting efficiency, cutting efficiency can reach more than twice that of long wire cutting;
2) Unidirectional uniform motion, low loop loss, long service life, and minimal damage to the guide wheel, reducing consumables costs;
3) Unidirectional high-speed uniform motion, better stability of the cutting process centerline, higher cutting accuracy, can reduce subsequent machining allowances and processes, greatly reducing machining costs.
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